Specialist Supplier Of Electronic Components, Semiconductors & Rugged Electronic Systems.

Allyanz Electronics, Semiconductors, Integrated Modules, Displays. Manufacturers Representative & Distributor Australia, NZ & South East Asia. Tel: +61.3.9759 5949

ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

LVDS Serial Interface
ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage
ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications
ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications
Swissbit Presents Industrial eMMC EM-30 - copy

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit’s EM-30 eMMC offers high performance with up to 300 MB/s for reading and 230 MB/s for writing.

Swissbit industrial grade 3D NAND e-MMC 5.1 bga
Swissbit Presents Industrial eMMC EM-30 - copy
ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

issi1 car technoology
ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy
IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
ISSI Announces Full Function LED Driver IC For Automotive Interior Lighting

ISSI Full Function LED Driver IC For Automotive Interior Lighting. Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog IC solutions, has announced a single chip solution for automotive interior lighting.

IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting
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New from NSI – 3 inch touchpad modules ideal for Medical & Industrial Electronics

Utilizing the latest, most advanced solid state touch sensing technology, the TPM Series touchpad module from NSI is an extremely high accuracy pointing device, ideal for the most demanding cursor control applications.

The device provides both conventional X and Y-axis cursor movement with plug-and-play, multi-finger gesture support for enhanced user interaction.

The mutual-capacitance based tracking engine combines the benefits & reliability of solid state sensing (no moving parts) with the precision, functionality and performance associated with NSI technologies.

NSI - 3 inch touchpad modules ideal for Medical & Industrial Electronics

The unit has been designed to be panel mounted, integrated into OEM keyboards and consoles.

  • Solid state, 3 inch touchpad module
  • Capacitive touch sensing tracking engine
  • Multi-finger gesture support
  • Output: USB/PS2 (auto-select)
  • Smooth operation in rugged environments
  • Immunity to moisture, water and liquid contaminants
  • Available with or without polyester overlay

Please contact Allyanz today for further details, & options we can offer for your next touchpad interface design.

ISSI offers complete range of eMMC flash

ISSI EMMC Memory and Long Term Support

Integrated Silicon Solution, Inc., ISSI, an industry leader in advanced memory and analog solutions, supports a complete range of eMMC Flash devices.

ISSI Industrial and Automotive Applications

Ranging in size currently from 4GB to 128GB, ISSI eMMC devices provide the ideal embedded storage solution for the Automotive, Industrial and Medical applications, which require high performance endurance across a wide range of operating temperatures, with long-term support.

These devices are available in Industrial as well as Automotive grade in both 100-ball BGA and 153- ball BGA.

ISSI EMMC Parts Numbers And Specifications

ISSI eMMC devices integrates MLC NAND Flash memory and an intelligent e.MMC controller inside a JEDEC standard package, providing a standard, easy to design with interface to the host. The controller directly manages the NAND flash, implementing functions like bad block management, error handling (ECC), static and dynamic wear-levelling, IOPS optimization and read sensing.

ISSI EMMC Controller to Host Processor and NAND Flash

ISSI eMMC devices support Enhanced Mode where the device can be configured as pseudo-SLC (pSLC) for higher read/ write performance, endurance and reliability.

Please contact Allyanz today for further details, and samples for ISSI’s range of eMMC Flash.

ISSI sampling 512Mb SPI NOR Flash for Automotive & Industrial Markets

ISSI sampling 512Mb SPI NOR Flash for Automotive & Industrial Markets

Integrated Silicon Solution, Inc., ISSI, an industry leader in advanced memory and analog solutions, is now sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

ISSI’s SPI NOR Flash product supports a wide operating temperature range of -40C to 125C, making them ideal for next generation automotive, industrial and Internet of Things, IoT applications.

This 512Mb SPI NOR flash exceeds AEC- Q100 requirements and is PPAP ready.

This extends our range of SPI NOR support from 256Kb all the way up to 512Mb density.

The 512Mb SPI NOR flash is available in multiple package choices, including 16-pin SOIC 300mil, WSON 8×6 mm, and the 24-ball TFBGA 6x8mm 5×5 package, in addition to the KGD (Known Good Die) option.

ISSI sampling 512Mb SPI NOR Flash for Automotive & Industrial Markets - Data Table

ISSI is also working on Multi-Chip Package (MCP) options of SPI NOR Flash and its’ DRAM product line.

In addition to SPI NOR flash, ISSI offers a strong portfolio of DRAMs including SDR, DDR2, DDR3 and mobile SDR, LPDDR, LPDDR2; a complete line-up of both asynchronous and synchronous SRAMs with densities from 64Kb to 72Mb; and a broad portfolio of SPI NAND and parallel NAND Flash, including eMMC.

ISSI also has a range of Known Good Die (KGD) memories in its portfolio.

Please contact Allyanz today for further details, and samples for ISSI’s range of SPI NOR Flash.

Achronix Speedcore eFPGAs Offer Unbeatable Bandwidth and Latency Performance

Achronix Speedcore embedded FPGA (eFPGA) IP from Achronix has brought the power and flexibility of programmable logic to ASICs and SoCs.

Achronix Speedcore eFPGA IP

Customers can integrate a Achronix Speedcore eFPGA into an SoC for high-performance, compute-intensive and real-time processing applications such as AI, machine learning, 5G wireless, networking and automotive.

Proven on the TSMC 16FF+ process node, Speedcore eFPGA IP enables customers to create a customized programmable fabric.

Users specify their logic, memory and DSP resource needs, then Achronix configures the Speedcore IP to meet their individual requirements. Speedcore look-up-tables (LUTs), RAM blocks and DSP64 blocks can be assembled like building blocks to create the optimal programmable fabric for any given application. Achronix delivers the customized Speedcore eFPGA instance as a hard macro in GDSII format along with a customized version of ACE design tools.

There are many benefits to embedding Speedcore technology into an SoC. Compared to a separate standalone FPGA, Speedcore eFPGA IP offers the following:

  • 10× higher bandwidth
  • 100× lower latency
  • 10× lower cost
  • 50% lower power

Achronix Speedcore FPGA Compiled Architecture

Achronix Speedcore eFPGA IP

As opposed to a one-size-fits-all approach to building an embeddable FPGA fabric, the Speedcore solution is compiled architecture.

Rather than having to pick from a library of pre-built fabrics, a system architect can define a mix of LUTs, LRAMs, BRAMs and DSP blocks for a cluster, then specify overall resource goals for the fabric along with an aspect ratio (expressed in clusters). The resulting fabric is an X by Y array of these custom clusters.

During this specification phase, Achronix returns a detailed proposal on the custom fabric, plus a software model for evaluation using ACE design tools.

 

Customers can specify the resource counts for their Speedcore instance for the following building blocks:

  • Logic – look-up-tables (LUTs) plus integrated wide MUX functions and fast adders
  • Logic RAM – 4 kb per memory block
  • Block RAM – 20 kb per memory block
  • DSP64 – each block has a 18 × 27 multiplier, 64-bit accumulator and 27-bit pre-adder
  • Custom blocks – customer/application-specific functions

Resource & performance specifications include:

Speedcore logic density – from 5K to 2M LUTs

Speedcore performance – max 750 MHz

Speedcore power – 12 mW static power per 1,000 LUTs at 105°C (on the TSMC 16FF+ process)

Speedcore die size – 0.20 mm2 per 1,000 LUTs (on the TSMC 16FF+ process)

For more information on SpeedCore eFPGAs from Achronix, please contact Allyanz today.

Lattice Extends Video Interface Platform to GigE/USB 3.0

Lattice Video Interface Platform GigE/USB 3.0

Lattice Extends Video Interface Platform to GigE USB 3.0
Need to quickly build embedded vision prototypes with Ethernet connectors running at Gigabit speeds?

Lattice’s latest I/O board for the Video Interface Platform (VIP) does just that. The new I/O board is the latest addition to Lattice’s highly modular platform.

By replacing cumbersome manual wiring with a unified connector, designers can quickly build plug-and-play solutions.

The new GigE/USB 3.0 I/O board allows developers to quickly and easily add network connectivity options to Lattice’s award-winning Embedded Vision Development Kit.

Lattice Video Interface Platform GigE USB 3.0

The kit combines a CrossLink mobile bridging input board, an optimised ECP5 image signal processing board, and high res HDMI VIP Input and Output boards into a ready-to-use platform.

The VIP platform also offers IP from 3rd party partners including commercial grade image signal processing and networking stacks, Helion Vision’s GigE Vision, multiple sensor board inputs, and DisplayPort IP from Bitec.

For more information on the Video Interface Platform from Lattice, please contact Allyanz today.

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