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ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage

ISSI is currently sampling 64 GB, 128 GB & 256 GB devices, supporting UFS 2.1, and UFS 2.2. ISSI’s UFS product family provides the ideal embedded storage solution for the Automotive, Industrial, Medical, Networking, and Consumer applications, which require high performance, endurance, and low power across a wide range of operating temperatures, with long-term support.

ISSI Now Offering UFS 2.1/2.2 - Universal Flash Storage

ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications

ISSI’s SLC NAND Flash devices support a wide operating temperature range of -40C to 105C, making them ideal for next generation automotive, industrial and Internet of Things (IoT) applications. Both the SPI NAND and parallel NAND Flash devices are AEC-Q100 qualified meeting the stringent automotive qualification requirements. ISSI offers parallel SLC NAND in 1Gb, 2Gb, 4Gb & 8Gb densities.

ISSI sampling AEC-Q100 Qualified SLC NAND Flash for Automotive & Industrial Applications

Swissbit Presents Industrial eMMC EM-30 - copy

Swissbit Presents Industrial eMMC EM-30

Swissbit, a leading manufacturer of flash memory solutions, presents its latest technology for demanding industrial, medical & automotive markets: eMMC memory, EM-30.

Swissbit’s EM-30 eMMC offers high performance with up to 300 MB/s for reading and 230 MB/s for writing.

Swissbit industrial grade 3D NAND e-MMC 5.1 bga

Swissbit Presents Industrial eMMC EM-30 - copy

ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy

ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog solutions, has begun sampling production units of automotive grade 512Mb Serial (SPI) NOR Flash.

ISSI Introduces 512Mb SPI NOR Flash for Automotive & Industrial Markets - copy

IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting

ISSI Announces Full Function LED Driver IC For Automotive Interior Lighting

ISSI Full Function LED Driver IC For Automotive Interior Lighting. Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory and analog IC solutions, has announced a single chip solution for automotive interior lighting.

IS32LT3175-full-function-linear-led-driver-ic-for-automotive-interior-lighting

Platform Manager From Lattice Transforms Board Power & Digital Management

Published 21/10/2010

Lattice Platform Manager

Programmable Devices Reduce Cost Up to 50%; Cut Weeks From Design Time; Monitor Power Supplies with 0.7% Accuracy

Lattice Semiconductor Corporation (NASDAQ: LSCC) has announced its third-generation mixed-signal devices, the Platform Managerâ„¢ family. The programmable Platform Manager devices are expected to simplify board management design significantly by integrating programmable analog and logic to support many common functions, such as power management, digital housekeeping and glue logic. By integrating these support functions, Platform Manager devices can not only reduce the cost of these functions compared to traditional approaches, but also can improve system reliability and provide a high degree of design flexibility that minimizes the risk of circuit board re-spins.

Lattice Platform Manager

About the Platform Manager Family

The Platform Manager product family consists of two devices, the LPTM10-1247 and LPTM10-12107. The LPTM10-1247 device can monitor 12 voltage rails and supports 47 digital I/O, while the LPTM10-12107 monitors up to 12 voltage rails and supports 107 digital I/O. Functionally, these devices include both a power management section and a digital board management section. The power management section consists of a programmable threshold, precision differential input comparator block with an accuracy of 0.7%, a 48-macrocell CPLD, programmable hardware timers, a10-bit analog to digital converter and a trim block for the trimming and margining of supplies. The digital board management section consists of a 640-LUT FPGA and programmable logic interface I/O.

For more details on the very popular Platform Manager devices from Lattice, please contact us.

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MICREL Cuts Power Requirement For Ethernet Connectivity in Half

Published 20/10/2010

Micrel Inc., an industry leader in analog, high bandwidth communications and Ethernet IC solutions, has released the KSZ8051/8031 family of ultra low-power, small package single-port 10/100 Physical Layer Transceivers. These devices provide the MII or RMII interface to transmit and receive data over standard CAT-5 unshielded twisted pair (UTP) cable or fiber. The solution is based on Micrel’s enhanced mixed-signal design which enables power consumption to be reduced by half compared to the prior generation. The devices feature high integration (on-chip termination and integrated regulator), reduced system cost and simplified system design. The ICs also feature higher performance and an extended feature set all in very compact package options.

Micrel PHY Layer Transcievers

Full compliance to the IEEE 802.3/802.3u standard ensures that the devices will work seamlessly with other standards compliant, already deployed devices. The ultra low power design satisfies the green requirement in today’s consumer, industrial and automotive Ethernet applications. On-chip termination not only eliminates components, simplifies PCB design and reduces system BOM, but also improves overall signal integrity and EMI emissions. The single external power supply (3.3V), with integrated regulator, enables core operation at 1.2V with IO at 1.8V/2.5V/3.3V. The KSZ8051MLL/FLL comes in a 48-pin LQFP package and provides a MII MAC interface with the option to interface to copper or fiber media. The KSZ8051MNL/RNL is a copper transceiver housed in a 32-pin QFN with the option for a MII or RMII MAC interface. The KSZ8031RNL offers the smallest package, 24-pin QFN, with an RMII MAC interface. Auto MDI/MDIX crossover support eliminates the need for a cross-over cable, thus reducing installation costs. Easy to use, the LinkMD(R) TDR-based cable diagnostics allow for identification of common cabling problems, including those not addressed by IEEE standards. This simplifies network deployment and reduces network downtime.

The low emissions and Micrel’s signature high reliability and quality also make these devices suitable for connectivity applications in the fast growing industrial automation and automotive markets.

For more details on these new PHY Layer Transcievers from Micrel, please contact us.

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ISSI ANNOUNCES 64Mb and 32Mb Pseudo SRAMs (PSRAMs) TARGETED FOR WIRELESS, INDUSTRIAL, EMBEDDED, and AUTOMOTIVE APPLICATIONS

Published 20/10/2010

Integrated Silicon Solution, Inc., a leader in advanced memory solutions, has added 64Mb and 32Mb density devices to their line of Pseudo SRAMs. These new devices add to the previously released 4Mb and 8Mb parts, and give the design engineer a wide range of densities from which to choose to best fit the application’s requirements. These PSRAMs are designed to provide the characteristics and ease of use of an SRAM, but with the improved density and cost reduction associated with using a DRAM.

The 64Mb is organized as 4Mx16 and the 32Mb is 2Mx16. The IS66WVE2M16ALL/BLL and the IS66WVE4M16ALL/BLL are the 1.8V and 3.3V options of the asynchronous solution for this product family. The IS66WVC2M16ALL, IS66WVD2M16ALL, IS66WVC4M16ALL and the IS66WVD4M16ALL are the CRAM 1.5 and CRAM 2.0 options of this product family. As such, this product line provides the designer with a variety of high density, cost effective, low power memory solutions.

In these products, refresh of the DRAM cells is handled internally, eliminating the need for an external refresh controller. Partial Array Refresh (PAR), low standby current and Deep Power Down (DPD) modes of these products makes it ideal for low power applications. The CRAM 1.5 option adds the synchronous / burst interface mode, an on-die temperature sensor for temperature compensated refresh (TCR), fixed latency, and drive strength control for the outputs. In addition to the CRAM 1.5 feature set, CRAM 2.0 adds a multiplexed address and data bus for reduced pin count.

This cost effective, low power, high density memory combined with extended temperature, and options that include the Know Good Die (KGD) format make the product line perfect for wireless, industrial, embedded, and automotive applications.

For more details on these new Pseudo SRAMS from ISSI, please contact us.

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Lattice FPGA Design Software Webinar Australia / New Zealand – September 8, 2010

Published 14/08/2010

Lattice Power 2 You! Webinar Series –
Australia / New Zealand – September 8, 2010

lattice_edn_winners_2009

The Power 2 You! webinar helps you understand key design criteria for the power management functions shown in the below figure. In addition, the webinar will show you how to integrate them into a Power Manager II device. The resulting solution can be used across a wide range of applications and can be individually customized using Lattice’s PAC-Designer (R) software.

Attend this FREE Lattice Semiconductor seminar and you will walk away with in-depth technical knowledge of Lattice’s Power Manager Solutions.

All attendees receive a free copy of the Power 2 You! reference manual.

[ more information ]

Learn How to Design

Hot swap controllers
Supply OR’ing controllers using MOSFETs
Power feed through MOSFETs
Power supply sequencing with and without MOSFETs
Reliable monitoring voltages for fault and reset generation
Trimming and margining of board-mounted supplies

Register Now!

For more information please contact us.

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ISSI Releases 1 Gb High Speed DDR2 SDRAM for Automotive, Networking, Telecommunications, and Industrial Applications

Published 29/01/2010

ISSI, a leader in advanced memory solutions, has added the 1 Gigabit density to their family of DDR2 SDRAMs. The first device at this new density is the IS43DR16640A which is organized as 64Mx16 and packaged in an 84-ball BGA. This on-going expansion of the DDR2 SDRAM product family adds to ISSI’s already extensive offering of DRAM devices.

ISSI 400MHz - 72 MB Synchronous SRAM

This new device is available with clock speeds up to 533MHz (DDR2-1066), providing a data transfer rate of 4 gigabytes/sec in 32 bit systems. In addition to this new 1Gb device, ISSI also offers 512Mb and 256Mb DDR2 devices, with all three densities available in commercial, industrial and automotive grades. The 256Mb density includes 8Mx32 and 16Mx16 organizations and for the 512Mb density 32Mx16 and 64Mx8 organizations are available. ISSI plans to release x8 bit wide configurations of the 256Mb, and 1Gb devices later in 2010. The DDR2 DRAM product family from ISSI operates from a single 1.8V supply voltage.

For more details on the 1Gb DDR2 SDRAM, or other SRAM or DRAM devices from ISSI, please contact us.

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Allyanz Electronics, Semiconductors, Integrated Modules, Displays. Manufacturers Representative & Distributor Australia, NZ & South East Asia. Tel: +61.3.9759 5949

Platform Manager From Lattice Transforms Board Power & Digital Management

Programmable Devices Reduce Cost Up to 50%; Cut Weeks From Design Time; Monitor Power Supplies with 0.7% Accuracy

About the Platform Manager Family

MICREL Cuts Power Requirement For Ethernet Connectivity in Half

ISSI ANNOUNCES 64Mb and 32Mb Pseudo SRAMs (PSRAMs) TARGETED FOR WIRELESS, INDUSTRIAL, EMBEDDED, and AUTOMOTIVE APPLICATIONS

Lattice FPGA Design Software Webinar Australia / New Zealand – September 8, 2010

ISSI Releases 1 Gb High Speed DDR2 SDRAM for Automotive, Networking, Telecommunications, and Industrial Applications

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